Webdice. For low k wafer with heavy metal street; sawing process will need to ensure the blade shift within grooved area and deal with clogging during sawing the composite metal remain after groove, as shown in Fig.8. Fig. 8 Sawing mechanism; blade shift and cut process. The saw blade self sharpening need to be controlled to WebDec 12, 2002 · Successful integration of copper and low dielectric constant (low-k) materials is dependent on robust chemical-mechanical planarization (CMP) during damascene patterning. This process includes the direct removal of copper and interaction of the copper slurry with the underlying dielectric. Experiments were designed and performed to …
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